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1. general description the TFA9842BJ contains two identical audio power ampli?ers. the TFA9842BJ can be used as two single-ended (se) channels with a ?xed gain of 26 db. the TFA9842BJ comes in a 9-pin dil-bent-sil (dbs9p) power package. the TFA9842BJ is pin compatible with the tfa9841j, tfa9842j, tfa9843j and the tfa9843bj. the TFA9842BJ contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. this gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it. 2. features n 1 w to 7.5 w operation possibility n soft clipping n standby and mute mode n no on or off switching plops n low standby current n high supply voltage ripple rejection n outputs short-circuit protected to ground, supply and across the load n thermally protected n pin compatible with the tfa9841j, tfa9842j, tfa9843j and the tfa9843bj. 3. applications n televisions n monitors n pc speakers n boom boxes n mini and micro audio receivers. TFA9842BJ 2-channel audio ampli?er (se: 1 w to 7.5 w) rev. 01 1 march 2004 preliminary data sheet
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 2 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 4. quick reference data 5. ordering information table 1: quick reference data symbol parameter conditions min typ max unit v cc supply voltage operating 9 17 26 v no signal - - 28 v i q quiescent supply current v cc =17v; r l = w - 60 100 ma i stb standby supply current - - 10 m a p o output power thd = 10 %; r l =4 w ; v cc =17v 7 7.5 - w thd total harmonic distortion p o = 1 w - 0.1 0.5 % g v voltage gain 25 26 27 db svrr supply voltage ripple rejection f ripple = 1 khz - 60 - db table 2: ordering information type number package name description version TFA9842BJ dbs9p plastic dil-bent-sil power package; 9 leads (lead length 12/11 mm); exposed die pad sot523 -1
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 3 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 6. block diagram 7. pinning information 7.1 pinning fig 1. block diagram. 001aaa443 standby mute on short-circuit and temperature protection v ref 0.5v cc v cc v cc 9 4 in1 in2 out1 out2 svr civ mode 1 3 7 8 2 6 5 gnd TFA9842BJ 60 k w 60 k w fig 2. pin con?guration. TFA9842BJ 001aaa444 2 1 3 4 5 6 7 8 9 v cc in1 in2 out1 out2 svr civ mode gnd
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 4 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 7.2 pin description 8. functional description 8.1 input con?guration the input cut-off frequency is: (1) application: r i =60k w and c i = 220 nf: (2) as shown in equation 2 large capacitor values for the inputs are not necessary; so the switch-on delay during charging of the input capacitors can be minimized. this results in a good low frequency response and good switch-on behavior. 8.2 power ampli?er the power ampli?er is a single-ended (se) ampli?er with an all-npn output stage, capable of delivering a peak output current of 3 a. 8.2.1 output power measurement the output power as a function of the supply voltage is measured on the output pins at thd=10%;see figure 8 . the maximum output power is limited by the supply voltage of 26 v and the maximum available output current is 3 a (repetitive peak current). a minimum load of 3 w is required for v cc > 22 v; see figure 5 . the output power is measured with one channel driven. table 3: pin description symbol pin description in2 1 input 2 out2 2 loudspeaker terminal 2 civ 3 common input voltage decoupling in1 4 input 1 gnd 5 ground svr 6 half supply voltage decoupling (ripple rejection) mode 7 mode selection input (standby, mute and operating) out1 8 loudspeaker terminal 1 v cc 9 supply voltage f i cut off C () 1 2 p r i c i () ---------------------------- - = f i cut off C () 1 2 p 60 10 3 220 10 9 C () ---------------------------------------------------------------- - 12 hz ==
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 5 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 8.2.2 headroom typical cd music requires at least 12 db (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. at v cc =17v,p o = 5 w and r l =4 w at thd = 0.2 % (see figure 6 ), the average listening level (all) music power without any distortion yields: (3) the power dissipation can be derived from figure 9 for 0 db respectively 12 db headroom (see t ab le 4 ). for the average listening level a power dissipation of 4.2 w can be used for a heatsink calculation. 8.3 mode selection the TFA9842BJ has three functional modes, which can be selected by applying the proper dc voltage to pin mode (see t ab le 5 and figure 3 ). standby in this mode the current consumption is very low and the outputs are ?oating. the device is in standby mode when v mode < 0.8 v, or when pin mode is grounded. mute in this mode the ampli?er is dc-biased but not operational (no audio output). this allows the input coupling capacitors to be charged to avoid pop-noise. the device is in mute mode when 4. 5v(v cc - 2.0 v). table 4: power rating as function of headroom headroom power output (thd = 0.2 %) power dissipation; both channels driven 0db p o =5w p d = 8.4 w 12 db p o(all) = 315 mw p d = 4.2 w p oall () 510 3 15.85 ----------------- 315 mw == table 5: mode selection v mode ampli?ers 1 and 2 0 v to 0.8 v standby 4.5 v to (v cc - 3.5 v) mute (v cc - 2.0 v) to v cc on fig 3. mode selection. 001aaa416 standby all mute 1/2 on 0.8 4.5 v cc - 3.5 v cc v mode (v) v cc - 2.0
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 6 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 8.4 supply voltage ripple rejection the supply voltage ripple rejection (svrr) is measured with an electrolytic capacitor of 150 m f on pin svr using a bandwidth of 20 hz to 22 khz. figure 11 illustrates the svrr as function of the frequency. a larger capacitor value on pin svr improves the ripple rejection behavior at the lower frequencies. 8.5 built-in protection circuits the TFA9842BJ contains two types of temperature sensors; one measures local temperatures of the power stages and one measures the global chip temperature. at a local temperature of the power stage of approximately 185 c or a global temperature of approximately 150 c this detection circuit switches off the power stages for 2 ms. high impedance of the outputs is the result. after this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. this protects the TFA9842BJ against shorts to ground, to the supply voltage, across the load and also to high chip temperatures. the protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be ?owing through the short, just as much as the power stage can handle without exceeding the critical temperature level. 9. limiting values 10. thermal characteristics table 6: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage operating - 0.3 +26 v no signal - 0.3 +28 v v i input voltage - 0.3 v cc + 0.3 v i orm repetitive peak output current - 3 a t stg storage temperature non-operating - 55 +150 c t amb ambient temperature operating - 40 +85 c p tot total power dissipation - 35 w v cc(sc) supply voltage to guarantee short-circuit protection -24v table 7: thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air 40 k/w r th(j-c) thermal resistance from junction to case both channels driven 2.0 k/w
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 7 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 11. static characteristics [1] a minimum load of 3 w is allowed at v cc >22v. [2] with a load connected at the outputs the quiescent supply current will increase. [3] the dc output voltage with respect to ground is approximately 0.5v cc . 12. dynamic characteristics [1] the noise output voltage is measured at the output in a frequency range from 20 hz to 22 khz (unweighted), with a source impedance r source =0 w at the input. table 8: static characteristics v cc =17v; t amb =25 c; r l =4 w ; v mode =v cc ; v i = 0 v; measured in test circuit figure 12 ; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc supply voltage operating [1] 91726v i q quiescent supply current r l = w [2] - 60 100 ma i stb standby supply current v mode =0v - - 10 m a v o dc output voltage [3] -9-v v mode mode selection input voltage on mode v cc - 2.0 - v cc v mute mode 4.5 - v cc - 3.5 v standby mode 0 - 0.8 v i mode input current on pin mode 0v 9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 8 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) [2] svrr is measured at the output, with a source impedance r source =0 w at the input and with a frequency range from 20 hz to 22 khz (unweighted). the ripple voltage is a sine wave with a frequency f ripple and an amplitude of 300 mv (rms), which is applied to the positive supply rail. [3] output voltage in mute mode (v mode = 7 v) and an input voltage of 1 v (rms) in a bandwidth from 20 hz to 22 khz, so including noise. v i = 100 mv; v cc =17v. thd=10%. fig 4. ac output voltage as function of mode selection voltage. fig 5. output power (one channel) as function of supply voltage for various loads. v cc = 17 v; f = 1 khz; r l =4 w .v cc = 17 v; p o = 1 w; r l =4 w . fig 6. total harmonic distortion-plus-noise as function of output power. fig 7. total harmonic distortion-plus-noise as function of frequency. 20 v mode (v) 04812 v o ( m v) 16 10 7 10 6 10 5 10 4 10 3 10 2 10 1 001aaa417 p o (w) 820 12 24 28 v cc (v) 16 0 40 30 10 20 001aaa445 2 w 3 w 4 w 8 w r l = 1 w 10 2 10 1 10 - 1 10 - 2 001aaa419 10 - 1 10 2 110 p o (w) thd + n (%) 10 1 10 - 1 10 - 2 001aaa446 10 thd + n (%) f (hz) 10 2 10 3 10 4 10 5
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 9 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) thd = 10 %; r l =4 w ; f = 1 khz. v cc = 17 v; r l =4 w . fig 8. output power as function of supply voltage. fig 9. total (worst case, both channels driven) power dissipation as function of channel output power per channel. v cc = 17 v; r l =4 w .v cc =17v;r source =0 w ;v ripple = 300 mv (rms); a bandpass ?lter of 20 hz to 22 khz has been applied; inputs short-circuited. fig 10. channel separation as function of frequency (no bandpass ?lter applied). fig 11. supply voltage ripple rejection as function of frequency. p o (w) 814 10 16 18 v cc (v) 12 0 15 9 12 3 6 001aaa447 020 p o (w) 10 0 2 4 6 8 4 p d (w) 81216 001aaa422 - 100 0 - 80 - 60 - 40 - 20 001aaa423 10 a cs (db) f (hz) 10 2 10 3 10 4 10 5 0 - 80 - 60 - 40 - 20 001aaa424 10 svrr (db) f (hz) 10 2 10 3 10 4 10 5
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 10 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 13. application information 13.1 application diagram remark: switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 v. at high supply voltage it is recommended to use (schottky) diodes to the supply voltage and ground. 13.2 printed-circuit board 13.2.1 layout and grounding to obtain a high-level system performance, certain grounding techniques are essential. the input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small ac input signals. the small-signal ground tracks should be physically located as far as possible from the power ground tracks. supply and output tracks should be as wide as possible for delivering maximum output power. fig 12. application diagram. 001aaa448 60 k w 60 k w 220 nf standby mute on short-circuit and temperature protection v ref 0.5v cc v cc v cc 9 4 in1 in2 out1 out2 civ mode 1 3 7 svr 6 8 2 5 gnd TFA9842BJ v i 220 nf v i v cc 1000 m f 470 m f 470 m f 100 nf r l 4 w + - r l 4 w - + v cc 2.2 m f 10 k w 50 k w 270 w bc547 bc547 7.5 v micro- controller 47 m f 22 m f 1.5 k w 100 k w
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 11 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 13.2.2 power supply decoupling proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. the respective capacitor location should be as close as possible to the device and grounded to the power ground. proper power supply decoupling also prevents oscillations. for suppressing higher frequency transients (spikes) on the supply line a capacitor with low esr, typical 100 nf, has to be placed as close as possible to the device. for suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 m f or greater, must be placed close to the device. the bypass capacitor on pin svr reduces the noise and ripple on the mid rail voltage. for good thd and noise performance a low esr capacitor is recommended. 13.3 thermal behavior and heatsink calculation the measured maximum thermal resistance of the ic package, r th(j-c) , is 2.0 k/w. a calculation for the heatsink can be made, with the following parameters: t amb(max) =60 c (example) v cc = 17 v and r l =4 w t j(max) = 150 c (speci?cation). fig 13. printed-circuit board layout (single-sided); components view. audio power cs nijmegen 27 jan. 2003 / fp in2 + in1 + mute sb on tva - se2 + - se1 + +v p 1000 m f 1000 m f 1000 m f btl1/2 1 22 m f 10 k w 10 k w 001aaa426 100 nf 150 m f 220 nf 220 nf mode sgnd svr svr civ civ
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 12 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) r th(tot) is the total thermal resistance between the junction and the ambient including the heatsink. this can be calculated using the maximum temperature increase divided by the power dissipation: r th(tot) =(t j(max) - t amb(max) )/p d . at v cc = 17 v and r l =4 w (2 se) the measured worst-case sine-wave dissipation is 8.4 w (see figure 9 ). for t j(max) = 150 c the temperature raise, caused by the power dissipation, is: 150 - 60=90 c: p r th(tot) =90 c r th(tot) = 90/8.4 = 10.7 k/w r th(h-a) =r th(tot) - r th(j-c) = 10.7 - 2.0 = 8.7 k/w. this calculation is for an application at worst-case (stereo) sine-wave output signals. in practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see section 8.2.2 ). this allows for the use of a smaller heatsink: p r th(tot) =90 c r th(tot) = 90/4.2 = 21.4 k/w r th(h-a) =r th(tot) - r th(j-c) = 21.4 - 2.0 = 19.4 k/w. 14. test information 14.1 quality information the general quality speci?cation for integrated circuits, snw-fq-611 is applicable. 2 se loads; t amb =25 c; external heatsink of 10 k/w; music signals. fig 14. junction temperature as function of supply voltage for various loads. 8 150 100 50 0 12 28 v cc (v) 16 20 24 001aaa449 t j ( c) 4 w r l = 2 w 6 w 8 w 16 w
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 13 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 15. package outline fig 15. package outline. references outline version european projection issue date iec jedec jeita dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. plastic surface within circle area d 1 may protrude 0.04 mm maximum. sot523-1 0 10 mm 5 scale w m b p d h q 1 z 19 e e 1 m e 2 x a 2 non-concave d 1 d p k q 2 l 3 l 2 l qc e 00-07-03 03-03-12 dbs9p: plastic dil-bent-sil power package; 9 leads (lead length 12/11 mm); exposed die pad sot523-1 view b : mounting base side b unit b p l 1 cd (1) d h lq 2 mm 2.7 2.3 a 2 (2) 0.80 0.65 0.58 0.48 13.2 12.8 d 1 (2) 6.2 5.8 3.5 e h 3.5 e 2.54 e 1 1.27 e 2 5.08 4.85 q e (1) 14.7 14.3 z (1) 1.65 1.10 11.4 10.0 l 2 6.7 5.5 l 3 4.5 3.7 3.4 3.1 1.15 0.85 q 17.5 16.3 q 1 2.8 m 0.8 v 3.8 3.6 3 2 12.4 11.0 p k 0.02 x 0.3 w e h l 1 q v m
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 14 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 16. soldering 16.1 introduction to soldering through-hole mount packages this text gives a brief insight to wave, dip and manual soldering. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). wave soldering is the preferred method for mounting of through-hole mount ic packages on a printed-circuit board. 16.2 soldering by dipping or by solder wave driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speci?ed maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. 16.4 package related soldering information [1] for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] for pmfp packages hot bar soldering or manual soldering is suitable. table 10: suitability of through-hole mount ic packages for dipping and wave soldering methods package soldering method dipping wave dbs, dip, hdip, rdbs, sdip, sil suitable suitable [1] pmfp [2] - not suitable
9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 15 of 17 philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 17. revision history table 11: revision history document id release date data sheet status change notice order number supersedes TFA9842BJ 20040301 preliminary data - 9397 750 12847 -
philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 9397 750 12847 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 1 march 2004 16 of 17 18. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 20. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. hazardous voltage although basic supply voltages of the product may be much lower, circuit voltages up to 60 v may appear when operating this product, depending on settings and application. philips customers incorporating or otherwise using these products in applications where such high voltages may appear during operation, assembly, test etc. of such application, do so at their own risk. the philips customers agree to fully indemnify philips for any damages resulting from or in connection with such high voltages. furthermore philips customers are drawn to safety standards (iec 950, en 60 950, cenelec, iso, etc.) and other (legal) requirements applying for such high voltages. 21. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 1 march 2004 document order number: 9397 750 12847 published in the netherlands philips semiconductors TFA9842BJ 2-channel auto ampli?er (2 se) 22. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 4 8.1 input con?guration . . . . . . . . . . . . . . . . . . . . . . 4 8.2 power ampli?er . . . . . . . . . . . . . . . . . . . . . . . . . 4 8.2.1 output power measurement . . . . . . . . . . . . . . . 4 8.2.2 headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.3 mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.4 supply voltage ripple rejection . . . . . . . . . . . . . 6 8.5 built-in protection circuits . . . . . . . . . . . . . . . . . 6 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 thermal characteristics. . . . . . . . . . . . . . . . . . . 6 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 7 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 13 application information. . . . . . . . . . . . . . . . . . 10 13.1 application diagram . . . . . . . . . . . . . . . . . . . . 10 13.2 printed-circuit board . . . . . . . . . . . . . . . . . . . . 10 13.2.1 layout and grounding . . . . . . . . . . . . . . . . . . . 10 13.2.2 power supply decoupling . . . . . . . . . . . . . . . . 11 13.3 thermal behavior and heatsink calculation . . 11 14 test information . . . . . . . . . . . . . . . . . . . . . . . . 12 14.1 quality information . . . . . . . . . . . . . . . . . . . . . 12 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.1 introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.2 soldering by dipping or by solder wave . . . . . 14 16.3 manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 16.4 package related soldering information . . . . . . 14 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 18 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16 19 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 20 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 21 contact information . . . . . . . . . . . . . . . . . . . . 16

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